Apple commits $30B+ to Broadcom for 15 billion U.S.-made chips

Apple has signed a new multiyear deal with Broadcom worth more than $30 billion to design and manufacture custom silicon and wireless connectivity components in the United States. The agreement is expected to yield over 15 billion U.S.-made chips and is Apple’s largest commitment yet under its American Manufacturing Program, launched last year to onshore more of its supply chain.

The centerpiece is Broadcom’s facility in Fort Collins, Colorado, which will receive a $1.5 billion capital investment to expand and modernize production of radio frequency parts—including FBAR filters—and advanced wireless technologies used across Apple’s product line. The companies frame the deal as building toward an end-to-end domestic silicon supply chain, with both Tim Cook and Broadcom CEO Hock Tan crediting the current administration for backing the project.

The spending falls under Apple’s broader pledge to invest $600 billion in the U.S. economy over four years. The framing is heavily political: the press release repeatedly ties the manufacturing push to government support, positioning it as much as a domestic-policy statement as a business decision, though concrete job numbers remain vague at ‘hundreds’ of positions.